2003 Bond Update

In October 2003 voters in the Putnam City school district approved an $18.2 million bond proposal to maintain sound schools, sustain high-quality academic environments and enhance learning opportunities for district students. Projects started in spring 2004. Bond money will be issued to the district in yearly increments, with other projects beginning in 2005 and 2006. Here's an update on the use of these bond funds:

First Release of Bond Money, January 2004

Complete
· Band uniforms, Putnam City High School
· Band uniforms, Putnam City West High School
· Roof at Kirkland Elementary School
· PC Center renovation
· Textbooks

Second Release of Bond Money, January 2005

Complete
· Band instruments
· 12 new classrooms at Hefner Middle School
· Fire alarms panels for central monitoring 
· PC Center renovation - auxiliary services
· Roof at Central Middle School 
· Roof at Mayfield Middle School
· Roof at Windsor Hills Elementary School
· Technology
· Textbooks
· Sensors for passing lights (all sites)
· Intercoms at Overholser Elementary, Rollingwood Elementary, Wiley Post Elementary, Kirkland Elementary, Western Oaks Elementary, Ralph Downs Elementary
· New carpet and tile
· Central bakery and equipment

Third Release of Bond Money, January 2006

Complete
· Roof at Administration Building
· Roof at Harvest Hills Elementary School
· Roof at Hilldale Elementary School 
· Band and orchestra instruments
· Nine new classrooms at Putnam City North High School
· Maintenance vehicle
· Window replacement at Lake Park Elementary and Coronado Heights Elementary
· Window and door replacements at Central Middle School and Putnam City West High School
· Kitchen equipment
· Clocks – master system, 23 schools
· Parking resurfacing at Lake Park Elementary, Western Oaks Middle School, Hefner Middle School, Putnam City West High School, Putnam City High School, Transportation
· Switchgear at Lake Park Elementary, Western Oaks Middle School, Hefner Middle School, Putnam City West High School, Putnam City High School, Transportation
· Technology